| Sort | zavatra | Normal capability | Fahaizana manokana |
| isan'ny sosona | PCB henjana-flex | 2-14 | 2-24 |
| Flex PCB | 1-10 | 1-12 | |
| BIRAO, BIRAO | 0.08 +/- 0.03mm | 0,05 +/- 0,03 mm | |
| Min.hateviny | |||
| Max.hateviny | 6mm | 8mm | |
| Max.Size | 485mm * 1000mm | 485mm * 1500mm | |
| Hole & Slot | Min.Hole | 0,15 mm | 0,05 mm |
| Min.Slot Hole | 0.6mm | 0.5mm | |
| Aspect ratio | 10:01 | 12:01 | |
| soritry | Min. Width / Space | 0.05 / 0.05mm | 0.025 / 0.025mm |
| fandeferana | Trace W/S | ± 0.03mm | ± 0.02mm |
| (W/S≥0.3mm:±10%) | (W/S≥0.2mm:±10%) | ||
| Lavaka mankany amin'ny lavaka | ± 0.075mm | ± 0.05mm | |
| Haben'ny lavaka | ± 0.075mm | ± 0.05mm | |
| Impedance | 0 ≤ Sanda ≤ 50Ω : ± 5Ω 50Ω ≤ Sanda : ± 10%Ω | ||
| ara-nofo | Basefilm Specification | PI: 3mil 2mil 1mil 0,8mil 0,5mil | |
| ED&RA Cu : 2OZ 1OZ 1 / 2OZ 1 / 3OZ 1 / 4OZ | |||
| Basefilm Main mpamatsy | Shengyi / Taiflex / Dupont / Doosan / Thinflex | ||
| Coverlay Specification | PI: 2mil 1mil 0,5mil | ||
| LPI loko | Maitso / Mavo / Fotsy / Mainty / Manga / Mena | ||
| PI Stiffener | T : 25um ~ 250um | ||
| FR4 Stiffener | T : 100um ～2000um | ||
| SUS Stiffener | T : 100um ～400um | ||
| AL Stiffener | T : 100um ～1600um | ||
| scotch | 3M / Tesa / Nitto | ||
| EMI shielding | Sarimihetsika volafotsy / Varahina / Ranomainty volafotsy | ||
| Famaranana ambonin'ny tany | OSP | 0.1 - 0.3um | |
| HASL | Sn : 5um - 40um | ||
| HASL (Leed maimaim-poana) | Sn : 5um - 40um | ||
| ENEPIG | Ni: 1.0 - 6.0um | ||
| Ba : 0.015-0.10um | |||
| Au : 0,015 - 0,10um | |||
| Plating volamena mafy | Ni: 1.0 - 6.0um | ||
| Au : 0.02um - 1um | |||
| Flash volamena | Ni: 1.0 - 6.0um | ||
| Au : 0.02um - 0.1um | |||
| ENIG | Ni: 1.0 - 6.0um | ||
| Au : 0.015um - 0.10um | |||
| volafotsy immesion | Ag: 0.1 - 0.3um | ||
| Plating Tin | Sn : 5um - 35um | ||
| SMT | Type | 0.3mm pitch Connectors | |
| 0.4mm pitch BGA / QFP / QFN | |||
| 0201 Toetran'ny vokatra |